Samlex America SAM-100-12 - Manuel (Page 5)

4 | SAMLEX AMERICA INC. SAMLEX AMERICA INC. | 5
seCtIOn 2 | Introduction
deScrIptIon
The inverter converts 12 VDC voltage from battery or from other suitable 12 VDC source
to 115 V, 60 Hz AC voltage. The waveform of the of the AC output voltage is Modified
Sine Wave.
featureS
• High peak efficiency of 90%
• Very high power to weight ratio - compact and light weight
• Soft Start Technology for better surge performance
• Latest high power USB Charging Port, USB 3.0, Type A: 5 VDC, 2.1A
• Load controlled cooling fan for better efficiency
• Cool Surface Technology for cooler and safer touch temperature
• Universal Protection circuit for low / high DC input voltage, overload / short circuit,
over temperature and Ground fault
• Low Interference Technology for controlled RF noise
• Integrated 12V Power Plug (Cigar Plug)
Soft Start technology
This feature offers the following advantages:
• When the inverter is switched ON, the voltage ramps up to 115 VAC in around 2 sec.
If the load was already oN at the time of switching oN of the inverter, starting surge
current demanded by certain reactive devices like motors etc. will be reduced and
there will be less likelihood of the inverter shutting down due to overload.
• If the inverter is switched ON first and then a load with higher starting / inrush
current like SMPS / motor is switched oN, the voltage will dip momentarily and will
ramp up and reduce inrush / starting surge current in the load as above
• Similar overload reduction will be initiated during any other momentary overload
condition
Low Interference technology
Innovative circuit design and noise filtration circuitry reduces rf interference in TV pic-
ture, audio and radio equipment
cool Surface technology
Normally, heat dissipating components are mounted directly on internal metal chassis
surface of the inverter and hence, the chassis surface may rise to unsafe touch-tempera-
ture. In this inverter, heat-dissipating components are not mounted directly on the chas-
sis of the unit but on PCb (Printed Circuit board) mounted heat sink and, there is air gap
between the heat sink and the chassis surface. The heat sink is cooled by fan. As there
is no direct contact between the heat sink and the chassis, the chassis surface remains
much cooler and is safer to touch.